Core Technology

As a highly skilled RF/microwave technology & product development company, MTI's core competence includes:

  • ODU Application Technology
     - Weather-Proof Package Design
     - Heat Dissipation Simulation & Thermal Analysis
     - Lightning / Surge Protection Design
     - RF Plus MCU control technology for Temperature compensation
     - High Linearity & Sensitivity XCVR Design

  • Highly integrated microwave, mmWave module, and subsystem design
     - Various Linearization Technology
     - RF Pre-Distorter / Digital Pre-Distorter and Feed-Forward
     - Heat Dissipation Design
     - Enclosure / Heat Sink Design Capability & Thermal Flow Simulation
     - Shielding and PCB Layout Experience For EMI/EMC Performance

  • Chip On Board Design up to Ka Band
     For Thermal Dissipation and Compact Size

  • Thin Film MCM ( Multi-Chip Module) up to 38GHz
     For Low Cost Design Structure and Compact Size

  • High linearity and high power mobile base station module design
     The above core technology has been successfully built into our full range telecommunication and satellite communication products. In addition, in order to fulfill the emerging market demand for broadband networks, MTI has also been migrating to the new technology of broadband wireless access system.
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