Manufacturing Capability

Speed and Flexibility are two key factors that keep MTI successfully positioned in the field of RF/Microwave design and manufacturing. By collaborating with worldwide leading communication solution providers as an ODM/OEM partner , MTI has accumulated a vast range of expertise, and adapted/incorporated different forms of manufacturing into multiple production technologies. Our clients also benefit from efficient manufacturing costs and fast time-to-market volume production resulting from manufacturing facilities in both, Hsinchu, Taiwan and Wuxi, China.

  • Process Capability and Technology
    – Printed Circuit Board Assembly
        - Thin Film Process Automation
        - In-house SMT process to support engineering pilot run and new process development
        - ICT and AOI to improve final assembly yield
        - Sweating process for Mobile Power Amplifier assembly
        - MMIC Chip Automatic Pick & Place
        - Auto Wire Bonding Assembly

    – Final Integration and RF Testing
        - Automatic Test System platform for both software and hardware set-up
        - Dedicated manufacturing lines to improve Capital Expenditure and increase long term high-mix product manufacturing efficiency
About Us Products Services & Support Investors Careers Press Center