Design & Engineering Core Competencies
- Chip-On-Board Technology and Capability
- Chip-On-Board Features and Benefits
- Chip-On-Board Process Flow
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Chip-On-Board (COB) Technology brings better RF and thermal performance options which could not package bare die for system designer. In this technology, MTI could handle GaAs/GaN by Wafer/Gel pack/Waffle pack and design dispensing pattern for bare die to directly attached onto the surface of PCB or Pedestal (reduce voids residue), and establish the electrical connection from PCB to GaAS/GaN by auto wedge wire bonding or auto ball bonding process. MTI had excellence experience on silver adhesive of die bonding and wire length/wire loop control of wire bonding to support better performance of COB process. |
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Chip-On-Board Process Flow |
