Printed Circuit Board Assembly

• SMT subcontract process to support engineering pilot run, new process development ,and volume production
• Professional DFM (Design for manufacturability) expertise to facilitate design optimization
  1. Apply Valor system for DFM review
  2. Perform SMT DOE (Design of Experiment) to ensure optimization of SMT parameters and process stability
• Experienced customized SMT-process for special PCB fabrication
  1. Large dimension, high-density PCB
  2. Capable to handle complicated devices, QFN (Quad Flat No-leads), BGA (Ball-Grid Array), PoP (Package on Package), WLCSP (Wafer Level Chip Scale Package) 
• Perform SMT inspection through various tools in First Article SMT run to guarantee solderability
  1. X-ray, Cross Section on specific fine pitch components after SMT
  2. 3D SPI (Solder Paste Inspection), 3D AOI (Auto Optical Inspection) 
• Chip-on-board (COB) process
• Conformal Coating process

About SMT subcontract business, welcome to contact us

TEL: 886-3-577-3335  ext.:1121

Email: MTI.SMT@mtigroup.com

No. 1 Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan, R.O.C.